Discover your next big idea for life sciences at PACK EXPO Las Vegas
Experience a breakthrough in life sciences packaging—explore solutions from 2,300 suppliers spanning all industries, all in one place this September

See Hewlett-Packard technology in action at Pack Expo

Be sure to visit the H-P OEM partners at PACK EXPO International. They'll beat McCormick Place to demonstrate how H-P Thermal Ink Jet Technology canprovide exciting solutions for your package coding needs.

Pw 12679 Guide

During your trip to this year's PACK EXPO International be sure to visit Hewlett-Packard's OEM partners. They'll be at McCormick Place to demonstrate how HP Thermal Ink Jet Technology can provide exciting solutions for your packaging coding needs.

Receive a free Chicago restaurant guide when you stop by any of the following booths:

AT Information Products Booth #N-3404

Collins Ink Corp. Booth #N-5240

Digital Design Booth #S-2807

Nutec Systems Booth #S-1525 #M-22

Prism Inc. Booth #N-4738

RSI Print Systems Booth #E-7466

The restaurant guide is published by Packaging World and sponsored by Hewlett-Packard. This handy reference features the best Chicago has to offer.

For a free copy of the restaurant guide email your request to [email protected] or visit www.hp.com/oeminkjet.

Break out of the ordinary: see what’s new in life sciences packaging
<strong>At PACK EXPO Las Vegas, you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us in September to experience a breakthrough for life sciences products.</strong>
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Break out of the ordinary: see what’s new in life sciences packaging
List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
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List: Digitalization Companies From PACK EXPO