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Converting technologies into solutions

CMM’s 13th biennial exposition in April plans to offer answers for converting and package printing industries, through what it calls its most comprehensive educational program ever.

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Digital printing technologies, advanced web handling and process automation, e-commerce and critical management issues exemplify the current topics that will be addressed next month at CMM 2001’s three-day conference program, whose theme is “Converting Technology into Solutions: The Answer for Business Success.”

The conference will take place during the 13th biennial CMM International Exposition, scheduled April 23 through 26 at Chicago’s McCormick Place South Building.

Billed as the world’s largest showcase and educational forum for the converting, packaging and package printing industries, CMM 2001 expects more than 1ꯠ converting machinery and materials manufacturers and marketers to exhibit the latest products and technologies, using more than 420ꯠ sq’ of space. (A list of packaging-related exhibitors appears on p. 72.)

Exhibit hours are 10 a.m. to 5:30 p.m. April 23 to 25; and 10 a.m. to 3 p.m. on the show’s final day. Attendance is expected to top 32ꯠ, similar to 1999’s exposition. The show is produced and managed by Paperloop (New York, NY). Registration and show details are available at www.cmmshow. com.

CMM Intl. 2001’s conference program will include more than 20 sessions developed along three program tracks. Programs are scheduled to run from 8 a.m. to 12 p.m. April 23 and 24; and 8 a.m. to 12:30 p.m. April 25.

 

Conference schedule

 

The conference begins Monday, April 23 with three technical sessions and three management sessions. One technical session, Improving your quality and productivity printing lithographic folding boxes, will be given by GATF’s Bruce Teitz.

Advances in UV PSAs, including hot melts, with discussions on current technologies, market opportunities and processing equipment will be addressed by Steve Lapin, NW Coatings; W. Pat Foust, Craig Adhesives & Coatings; Ranjit Malik, Adhesives Research; Ingrid Brase, National Starch & Chemical; and Rolf Mueller, IST Metz GmbH.

The third technical conference will be presented by Neil I. Steinberg, Somerset Engineering, and AIMCAL technical consultant Edward D. Cohen. They’ll discuss substrate technologies and how they affect the coating process in The importance of the substrate in the converting process.

Management sessions that day include The great debate—packaging graphics printing processes. It features a Q&A between package buyers and industry spokespersons addressing their rationale for selecting a specific print technology. Presenters: John Baker, Sonoco Flexible Packaging; Frank Passarelli, Bobst Group; Achim Schmidt, Heidelberg USA; Lucinda Cole-Semans, FlexSys Training; Tom Jacques, PCMC; and Ron Buckingham, Parmalat Canada Bakery.

Anyone involved in forecasting, budgeting and analyzing future opportunities on a global basis is part of the target audience of Global aspects and market trends: end user/consumer packaging. Making presentations will be Yolanda Simonsis, Paper Film & Foil Converter; Howard Rappaport, Chemical Market Associates; Marie Rushton, PIRA Intl.; Corey Reardon, Alexander Watson Assn.; and Annette Comer, Martech.

New technologies in digital input, color separation, digital proofing and direct-to-plate technologies will be presented by GATF’s Greg Bassinger during the session What’s new, what’s hot on the electronic side of our business.

 

Tuesday sessions

 

Management sessions for day two of the conference start with Are new digital technologies a threat to your package-printing business? This session looks at how end-user customers are beginning to print more of their own packaging, particularly for short runs. How digital printing can help converters satisfy end users’ needs will be discussed by Converting Magazine’s Mark Spaulding and Packaging Digest’s Mary Ann Falkman.

Solutions to process automation will be addressed at Process automation—key to productivity. Paper Converting Machine’s Tom Apple will make a presentation, as will Rexroth Indramat’s Jim Hulman; Dri-Tec’s Matthew Tielkemeier; Hurletron’s Steven J. Siler; and EI3 Corp.’s Don Klimkowicz. Another session provides a look at market data, consumer influences and the latest technologies concerning Flexible packaging closures and closure technologies.

Tuesday’s technical sessions include Advances in coating technology, presented by Fred Shapiro, P-F Technical Services; Donald E. Albrecht, May Coatings; Bob Dages, Kroenert; Sujoy Guha, Wintress Eng.; Rick Jacobson, EMA Services; and Jim Nennig, Megtec Systems.

Practical techniques in flexography for corrugated printers is the subject of a session that will include remarks from John Bingham, Pamarco; Steven J. Dalbey, JM Fry Inks; Steve Rote, KemiArt; and Harvey Schwartz, MacDermid Graphic Arts. Presenters at Advances in electron beam technologies for flexible packaging include Andy Johnston and Jeff Warmkessel, Ashland Specialty Chemical; and Imtiaz Rangwalla, Energy Sciences.

Covering the basics and applications of UV/EB primer will be Craig Glotfelter, BASF; Brijesh Nigam, Sun Chemical; Rick Fisher, Fusion UV; Rick Sanders, Energy Sciences; Rita Loof, RadTech Intl.; and Bill West, Hartford Insurance.

 

Wednesday wrap-up

INTRODUCING! The Latest Trends for Life Sciences at PACK EXPO Southeast
The exciting new PACK EXPO Southeast 2025 unites all vertical markets in one dynamic hub, generating more innovative answers to packaging challenges for life sciences products. Don’t miss this extraordinary opportunity for your business!
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INTRODUCING! The Latest Trends for Life Sciences at PACK EXPO Southeast