See What’s Possible in Life Sciences Packaging @ PACK EXPO International
2,600 exhibitors. 150+ free educational sessions. See packaging solutions for life sciences & more @ PACK EXPO International, Oct 18-21 in Chicago
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RFID package for direct coil mounting

Hp 19995 Atmel Rfid Ata5577 Xdfn F


The ultra-small XDFN (extremely thin dual flat no leads) package includes a 363-bit read/write transponder IDIC. IDIC ATA5577M1 is a high-volume, low-frequency RFID device designed for small-tag applications including clamshell cards. Measures 2mm x 1.5mm x 0.37mm.
Atmel Corp.
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See What’s Possible in Life Sciences Packaging at PACK EXPO International
Explore new machinery & materials from 2,600 exhibitors. Gain insights from 150+ free educational sessions. Find solutions to tackle the toughest challenges—for life sciences & beyond—at North America’s largest packaging & processing event.
REGISTER NOW & SAVE
See What’s Possible in Life Sciences Packaging at PACK EXPO International