AAMI, the Association for the Advancement of Medical Instrumentation, announces the AAMI Foundation's Dr. Michael Scholla Packaging Engineer Scholarship,
AAMI
AAMI, the Association for the Advancement of Medical Instrumentation, announces the AAMI Foundation's Dr. Michael Scholla Packaging Engineer Scholarship, which supports students and professionals pursuing education in medical device or pharmaceutical packaging design or engineering.
Named for the late Michael Scholla, Emeritus Medical Packaging Fellow at DuPont Medical Packaging and longtime AAMI member, the Fund is meant to improve the pipeline of qualified packaging professionals in the medical field. In 2026, the Fund will disburse $3,000 to one student pursuing a career in the medical device or pharmaceutical fields. The winner will be conferred on stage at the AAMI neXus medical device conference in April, 2026.
Per Ralph Basile, who manages Philanthropy at the AAMI Foundation, the number of students awarded scholarships is expected to grow in the coming years, following the pattern of the Foundation’s clinical engineering scholarships.
“We envision the same thing for the future of the packaging scholarship program," says Basile.
Applicants must be:
Applicants must be:
- Enrolled in an accredited college or university
- Within or pursuing a program for medical device or pharmaceutical packaging.
Expected to remain in the academic program at the end of the academic year in 2026
Submission Deadline: February 15, 2026. More details can be found here.
