Messe Düsseldorf to Promote Interpack Alliance at IBIE 2016 and PACK EXPO 2016

At IBIE booth 9651 and PACK EXPO booth N-5824, visitor and exhibitor information for interpack PROCESSES AND PACKAGING 2017 (May 4 - 10, 2017 in Düsseldorf, Germany), components for processing & packaging 2017 (May 4 - 10, 2017 in Düsseldorf, Germany), Upakovka 2017 (January 24 ­ 27, 2017 in Moscow, Russia), Shanghai World of Packaging ­ SWOP (November 7 ­ 10, 2017 in Shanghai, China), Pack Print International 2017 (September 20 23, 2017 in Bangkok, Thailand), International Packtech India/FoodPex India (December 15 ­ 17, 2016 in Mumbai, India) and food processing & packaging exposyum (December 5 ­ 7, 2016 in Nairobi, Africa) will be available.

As the leading international trade fair for the industry, interpack attracts more than 2,700 exhibitors from over 58 countries every three years. They present a comprehensive international range of products, including the latest in packaging systems and machinery, packaging materials and confectionery machinery in 19 halls covering over 2 million square feet net of exhibit space. At the showąs last staging in 2014, 175,000 visitors from around the world participated in the event.

The components for processing and packaging˛ special show takes place during interpack with a new concept and in a more central location. It targets suppliers of drive, control and sensor equipment, products for industrial image processing, handling equipment, industrial software and communication as well as complete automation systems for packaging machinery.

For information on visiting or exhibiting at interpack 2017 or any of the other interpack alliance˛ trade fairs in the Messe Düsseldorf program, please visit booth 9651 at IBIE 2016 and N-5824 at PACK EXPO 2016 or contact Messe Düsseldorf North America, 150 North Michigan Avenue, Suite 2920, Chicago, IL 60601.