New Tool: ProSource
Checkout our packaging and processing solutions finder, ProSource.

Bostik Receives APC’s First Supplier Innovation Award

Bostik is pleased to announce that it is the first award winner of American Packaging Corporation’s (APC) Supplier Innovation Award Program.

This content was written and submitted by the supplier. It has only been modified to comply with this publication’s space and style.

Bostik is pleased to announce that it is the first award winner of American Packaging Corporation’s (APC) Supplier Innovation Award Program.

APC is a flexible packaging converter specializing in flexographic and rotogravure printing, multi-ply extrusion and adhesive lamination of film, paper and foil. The corporation also fabricates bags and pouches with a variety of special features.

In 2013, APC established a Supplier Innovation Award Program to recognize supply partners that go above and beyond supporting existing business. While the program was created three years ago, APC had not found a supplier worthy of the recognition until this year.

For a year and a half, Bostik has worked with APC’s Engineered Laminations and Coatings Center of Excellence to develop an Extrudable Hot Melt resin system that can be applied using typical extrusion coating equipment. This system improves performance and stability of supply for APC’s customers and products.

Additionally, APC determined that this technology can have several other end uses, allowing the corporation to approach new markets and expand opportunities.

Bostik’s dedication, commitment and support of this innovative new technology helped APC turn this idea into reality. As a result, Bostik will be awarded with a plaque in recognition of its efforts this fall.

Test Your Supply Chain Smarts
Take Healthcare Packaging's supply chain quiz to prove your knowledge!
Read More
Test Your Supply Chain Smarts
How to Honor a Leader
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago.
Read More
How to Honor a Leader