Bostik is pleased to announce that it is the first award winner of American Packaging Corporation’s (APC) Supplier Innovation Award Program.
APC is a flexible packaging converter specializing in flexographic and rotogravure printing, multi-ply extrusion and adhesive lamination of film, paper and foil. The corporation also fabricates bags and pouches with a variety of special features.
In 2013, APC established a Supplier Innovation Award Program to recognize supply partners that go above and beyond supporting existing business. While the program was created three years ago, APC had not found a supplier worthy of the recognition until this year.
For a year and a half, Bostik has worked with APC’s Engineered Laminations and Coatings Center of Excellence to develop an Extrudable Hot Melt resin system that can be applied using typical extrusion coating equipment. This system improves performance and stability of supply for APC’s customers and products.
Additionally, APC determined that this technology can have several other end uses, allowing the corporation to approach new markets and expand opportunities.
Bostik’s dedication, commitment and support of this innovative new technology helped APC turn this idea into reality. As a result, Bostik will be awarded with a plaque in recognition of its efforts this fall.
