New packaging solutions for life sciences, all at PACK EXPO in Chicago
Discover new packaging solutions from hundreds of suppliers specializing in life sciences, all under one roof at PACK EXPO International in Chicago.

Tie layer technology for foil-based flexible packaging

Glenroy, Inc. introduces HPC--a high-performance tie layer technology for foil-based flexible packaging. Developed using customer feedback, HPC (High Performance Component) is engineered to meet cost objectives without sacrificing performance.

Hp 20350 Glenroy Hpc Roll600 Thumb 346x306 6638
HPC flexible packaging structures feature chemical resistance, high-performance oxygen- and moisture-barrier properties, machinability and roll conformity, and economical pricing.

Manufactured with state-of-the-art extrusion lamination equipment, HPC is available as a component within Glenroy's line of foil-based flexible packaging laminations. HPC flexible packaging laminations are also available within Glenroy's line of ExpressWeb surface-printable packaging films, which are stocked and ready to ship within two to three business days.
New food packaging & processing solutions, all at PACK EXPO in Chicago
Experience the cutting edge of food packaging and processing innovation at PACK EXPO International this November. See machinery and equipment in action, discover new technologies, and learn sustainable solutions from experts, all in one place.
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Explore new technology from hundreds of life sciences suppliers.
At PACK EXPO International, you’ll find innovations from hundreds of exhibitors that specialize in pharmaceuticals, biologics, nutraceuticals, medical devices and more. No other show delivers as many solutions to keep your products safe and effective.
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Explore new technology from hundreds of life sciences suppliers.