The scholarship is awarded to students pursuing a career in the field of packaging and the winner will be recognized at the 2012 TAPPI PLACE Conference, held May 1-6, 2012 in Seattle, Washington.
“TAPPI is pleased to award the Daniel Siegel Memorial Scholarship to Natalie Quin in recognition of her outstanding academic success and personal achievements,” states Larry N. Montague, president and CEO of TAPPI. ”The industry needs bright young engineers and scientists like Natalie to ensure it continues to grow and develop innovative new products. The scholarship will assist her in pursuing a career in packaging which is one of the most important product areas in the pulp, paper and converting industries.”
Quin is a junior majoring in Packaging Science with a minor in Entrepreneurship. She is a member of the Packaging Science Club and will intern this summer with 3M in Minneapolis. Other areas of interest include club water polo and the Clemson Organic Farm. Quin was also recently part of a first place team for the Dansico Knowledge Competition and on the second place team competing for the RCA Student Culinology® Competition.
The Daniel Siegel Memorial Scholarship is designed to encourage students to pursue careers in packaging and to raise awareness of the TAPPI Polymers, Laminations, Adhesives, Coatings, and Extrusions (PLACE) Division. It's funded by the Siegel family and MICA Corporation in honor of Daniel Siegel, founder and chair of MICA Corp. Siegel's innovations in water-based adhesive technology were game changers of their time and continue to be the standard for world-wide manufacturers of flexible packaging materials. MICA Corp. is a supplier of primers, coating, and adhesives to the flexible packaging industry.
“TAPPI is pleased to award the Daniel Siegel Memorial Scholarship to Natalie Quin in recognition of her outstanding academic success and personal achievements,” states Larry N. Montague, president and CEO of TAPPI. ”The industry needs bright young engineers and scientists like Natalie to ensure it continues to grow and develop innovative new products. The scholarship will assist her in pursuing a career in packaging which is one of the most important product areas in the pulp, paper and converting industries.”
Quin is a junior majoring in Packaging Science with a minor in Entrepreneurship. She is a member of the Packaging Science Club and will intern this summer with 3M in Minneapolis. Other areas of interest include club water polo and the Clemson Organic Farm. Quin was also recently part of a first place team for the Dansico Knowledge Competition and on the second place team competing for the RCA Student Culinology® Competition.
The Daniel Siegel Memorial Scholarship is designed to encourage students to pursue careers in packaging and to raise awareness of the TAPPI Polymers, Laminations, Adhesives, Coatings, and Extrusions (PLACE) Division. It's funded by the Siegel family and MICA Corporation in honor of Daniel Siegel, founder and chair of MICA Corp. Siegel's innovations in water-based adhesive technology were game changers of their time and continue to be the standard for world-wide manufacturers of flexible packaging materials. MICA Corp. is a supplier of primers, coating, and adhesives to the flexible packaging industry.
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