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The workshop titled, Identifying Temperature Profiles to Address the Challenges of the Canadian Market Shipping Lanes, will focus on applications of Canadian based profiles in new designs and design tradeoffs. The workshop will also review design methodologies and materials and how they can be best applied to the extreme Canadian weather requirements.
"Using scientifically rationalized temperature profiles to qualify packaging system is mandatory," Bedard said. "In this workshop you will learn how to do it and we will also share results from mapping the Canadian transportation system for the last 6 years.''
Other aspects that the Temperature Profiles workshop that Bedard will address include;
•Review of case examples of mapping projects done for Canadian shipments
•Discuss available 3rd party profiles and how they apply to the Canadian market
•Review of the Canadian weather extremes; how they apply to domestic and international shipping lanes.
To learn more, join Jean Bedard and Anthony Alleva at this year's IQPC Cold Chain and Temperature Management Summit on Tuesday, February 22 for Workshop C 11:15 - 2:15. You can also contact Jean directly at 405-661-5966 or email.
