New packaging solutions for life sciences, all at PACK EXPO in Chicago
Discover new packaging solutions from hundreds of suppliers specializing in life sciences, all under one roof at PACK EXPO International in Chicago.

Packaging Solutions

See them at PACK EXPO Las Vegas, Booth SL-6107! Emerson Floor to Cloud packaging solutions empower smarter packaging lines and more efficient processes, enabling manufacturers to continuously improve plant productivity, sustainability, and safety.

Aventics Series AF2 flow sensor
Aventics Series AF2 flow sensor

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At PACK EXPO Las Vegas, Emerson will showcase its Floor to CloudTM packaging automation solutions. The company also will sponsor two events: the annual Packaging & Processing Women’s Leadership Network (PPWLN) breakfast and the Amazing Packaging Race. All women registered for PACK EXPO Las Vegas are invited to the free PPWLN breakfast and program on Tuesday, September 12, at 7:30 a.m. in Room N-247. Following the breakfast, attendees will have the opportunity to take a private show floor tour and participate in a Q&A with Lisa Propati, vice president and general manager of Weiler Labeling Systems, as well as other packaging executives. As part of the Amazing Packaging Race, teams from U.S. colleges, trade schools, and universities will race to complete tasks and solve problems at booths across the PACK EXPO Las Vegas show floor.

Product highlights include:

The Aventics Series Advanced Valve (AV) system with advanced electronic system (AES) is the first pneumatic valve system with an integrated Open Platform Communications Unified Architecture (OPC UA). The AES helps with interoperability challenges and accesses data more easily, while the digital twin integration improves productivity efficiency and reduces costs. 

Aventics Series AF2 flow sensors monitor air consumption in pneumatic systems, enabling rapid intervention if leaks occur to help users optimize energy consumption, reach net-zero targets, prevent machine downtime, and reduce costs. A high-flow model expands compressed air monitoring beyond individual machines to benefit larger air lines and systems.

Multimedia monitoring solutions, including CoreTigo wireless communication, analyze water, compressed air, gases, electricity, steam (WAGES), and other utilities. The Edge analytics dashboard measures efficiency, optimizes productivity, and avoids or reduces downtime.

Movicon.NExT HMI/SCADA is a modular, scalable platform that solves automation problems for both CPGs and original equipment manufacturers (OEMs), from the single machine level to a complete plantwide IIoT project implementation. Among Movicon.NExT modules, Movicon Pro.Lean™ provides performance data and analytics for evaluations of overall equipment effectiveness (OEE) and Movicon Pro.Energy™ measures and tracks consumption, while the advanced Movicon NExT.AR solves operational problems through Movicon.NExT HMI/SCADAMovicon.NExT HMI/SCADAvisualization tools that allow personnel to evaluate previously unreachable equipment. Emerson also provides Movicon WebHMI, an HTML5-based visualization tool that can be used as a standalone HMI product running on Windows or Linux operator panels, or as a Web Client for Movicon.NExT SCADA applications, as well as Connext™, an industrial protocol gateway. 

PACSystems Edge Solutions is an advanced portfolio of edge computing and control systems and includes edge hardware and software that help simplify problem-solving at the machine level and allow easy, cost-effective analytics and communication at the edge. PACSystems Edge Solutions includes true edge controllers, edge computing devices, and compact controllers. They leverage Movicon.NExT, WebHMI, Connext OPC UA server, and PACEdge platforms in optimized software packages to provide powerful and flexible connectivity and visualization and a cloud-enabled toolset.

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