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Balluff: Machine Mount IO-Link Mini-Masters for Industrial Ethernet

Compact IO-Link masters for resilient distributed modular controls architecture.

Compact IO-Link masters for resilient distributed modular controls architecture.
Compact IO-Link masters for resilient distributed modular controls architecture.

Balluff’s new 4-port slim design IO-Link masters can connect a multitude of smart devices over IO-Link to build a distributed machine mount controls architecture for today’s automation.

With their robust IP67 housing, these industrial Ethernet based IO-Link masters can be mounted directly on the machine closer to the sensors and actuators—keeping short cable runs and adding enhanced diagnostics. EtherNet/IP, PROFINET and EtherCAT version of the masters are available.

These masters are ready for IIoT and Industry 4.0 application realization and are equipped with many features, including the following:

• Full service webserver for EtherNet/IP and PROFINET IO-Link masters enable remote diagnostics and configuration of the master as well as attached IO-Link devices.

• With SNMP on-board, the IO-Link master and all IO-Link devices are discoverable for network management systems for critical data gathering. This is made possible with the virtual IP address allocation feature of the master device.

• Ease of maintenance with parameter server data on the IO-Link master allows storing IO-Link device parameters for each port, so that when devices need to be changed the parameters can be automatically downloaded making smart devices plug-and -play.

The Balluff Type A IO-Link mini-master can host up to 120 configurable discrete I/O when connected to Balluff IO-Link I/O hubs with an expansion port. Balluff offers add-on instructions and function blocks to promote ease of IO-Link into the existing controls architecture.

LAST CHANCE TO SAVE! New Tech for Life Sciences at PACK EXPO Southeast
The exciting new PACK EXPO Southeast 2025 unites all vertical markets in one dynamic hub, generating more innovative answers to packaging challenges for life sciences products. Don’t miss this extraordinary opportunity for your business!
REGISTER ASAP FOR $30!
LAST CHANCE TO SAVE! New Tech for Life Sciences at PACK EXPO Southeast