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Balluff: Machine Mount IO-Link Mini-Masters for Industrial Ethernet

Compact IO-Link masters for resilient distributed modular controls architecture.

Balluff: Machine Mount IO-Link Mini-Masters for Industrial Ethernet
Compact IO-Link masters for resilient distributed modular controls architecture.

Balluff’s new 4-port slim design IO-Link masters can connect a multitude of smart devices over IO-Link to build a distributed machine mount controls architecture for today’s automation.

With their robust IP67 housing, these industrial Ethernet based IO-Link masters can be mounted directly on the machine closer to the sensors and actuators—keeping short cable runs and adding enhanced diagnostics. EtherNet/IP, PROFINET and EtherCAT version of the masters are available.

These masters are ready for IIoT and Industry 4.0 application realization and are equipped with many features, including the following:

• Full service webserver for EtherNet/IP and PROFINET IO-Link masters enable remote diagnostics and configuration of the master as well as attached IO-Link devices.

• With SNMP on-board, the IO-Link master and all IO-Link devices are discoverable for network management systems for critical data gathering. This is made possible with the virtual IP address allocation feature of the master device.

• Ease of maintenance with parameter server data on the IO-Link master allows storing IO-Link device parameters for each port, so that when devices need to be changed the parameters can be automatically downloaded making smart devices plug-and -play.

The Balluff Type A IO-Link mini-master can host up to 120 configurable discrete I/O when connected to Balluff IO-Link I/O hubs with an expansion port. Balluff offers add-on instructions and function blocks to promote ease of IO-Link into the existing controls architecture.

See What’s Possible in Life Sciences Packaging at PACK EXPO International
Explore new machinery & materials from 2,700 exhibitors. Gain insights from 150+ free educational sessions. Find solutions to tackle the toughest challenges—for life sciences & beyond—at North America’s largest packaging & processing event.
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See What’s Possible in Life Sciences Packaging at PACK EXPO International