Discover your next big idea for life sciences at PACK EXPO Las Vegas
Experience a breakthrough in life sciences packaging—explore solutions from 2,300 suppliers spanning all industries, all in one place this September

Void-fill system upgrade

Hp 18997 Aps
• a new engineering upgrade replaces the cutting-knife system that void-fill air-pillow systems use to slit the film prior to filling each pillow with air

• new vertical perforating process allows Express 3™ void-fill system to run without a knife, extending the time between maintenance cycles

• available for units currently installed, with new systems now coming standard with the Express 3 systems

Automated Packaging Systems
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