See What’s Possible in Life Sciences Packaging @ PACK EXPO International
2,600 exhibitors. 150+ free educational sessions. See packaging solutions for life sciences & more @ PACK EXPO International, Oct 18-21 in Chicago
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Void-fill system upgrade

Hp 18997 Aps
• a new engineering upgrade replaces the cutting-knife system that void-fill air-pillow systems use to slit the film prior to filling each pillow with air

• new vertical perforating process allows Express 3™ void-fill system to run without a knife, extending the time between maintenance cycles

• available for units currently installed, with new systems now coming standard with the Express 3 systems

Automated Packaging Systems
See What’s Possible in Life Sciences Packaging at PACK EXPO International
Explore new machinery & materials from 2,600 exhibitors. Gain insights from 150+ free educational sessions. Find solutions to tackle the toughest challenges—for life sciences & beyond—at North America’s largest packaging & processing event.
REGISTER NOW & SAVE
See What’s Possible in Life Sciences Packaging at PACK EXPO International