Liz Cuneo, Editor-in-Chief of Healthcare Packaging, and Sean Riley Editor-in-Chief of OEM magazine dig into the 2026 Medical Device Innovations Report, drawn from what the editors saw on the show floor at PACK EXPO Las Vegas. They cover why flexibility is displacing raw throughput as the number that matters most, how inspection is shifting from compliance checkpoint to process control, why labeling has become a data management problem, and where AI realistically fits.
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