Mukherjee has been with PTI for the past 25 years, including positions as vice president, advanced engineering services and director, computer aided engineering and simulation.
“Sumit has been at the forefront of solving brand owner packaging problems. His technical knowledge of molding processes, understanding of material properties and ability to create realistic simulations has been critical helping brand owners bring to market commercially-successful packages,” said Thierry Fabozzi, president, PTI. “He is perfectly suited to lead the company’s packaging technology efforts going forward.”
In his new capacity as CTO, Mukherjee will be leading all engineering functions at PTI including predictive modeling, product design, engineering, process lab and tooling services. In addition to managing technical support for customer projects, Mukherjee will be instrumental in bringing new leading-edge technical solutions to PTI, and helping to further develop engineering team members.
His work has brought improved accuracy to computer simulations which helps brand owners predicting top load, creep expansion, drop impact, squeeze strength, hot fill and retorting before a mold is cut. Further processes are being designed that model crystallization, strain hardening, infrared absorption and conformal cooling to develop robust lightweight, higher performing packages that will positively impact shelf life.
Over the past three decades, major brand owners have partnered with PTI to push material and structural packaging boundaries. PTI has been the silent partner behind many of the world’s most innovative packaging introductions.
