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DELO Enables Short Processes

The worldwide RFID market is gaining ground.

IDTechEx forecasts that the industry will grow by 2.4 to a total of 125 billion RFID tags by 2020*. Manufacturers of RFID labels focus on reasonably priced production. At the same time, the tag chip must be fixed in a reliable way. The new DELOMONOPOX AD268 epoxy resin copes with these requirements. It enables extremely fast production processes and the utmost reliability.

This anisotropic electrically conductive adhesive is designed for tasks in the RFID industry. However, it can also be used in other electronic packaging applications.

"Our adhesive has an improved resistance to humidity", explains Jens Amarell, Product Manager RFID at DELO Industrial Adhesives. "This makes it the ideal solution to applications where reliability is important, such for example in railway tickets, passports or protection of high-quality products against plagiarism."

DELOMONOPOX AC268 is used in chip attach processes, especially in flip-chip applications. It reliably bonds tiny chips, which partly measure only 400 microm, to defined positions on the RFID antenna. DELO could prove the continuously good electrical conductivity to customers' substrates with the help of storage test at 85 degree(s)C / 85 % r. h.

Thanks to the short curing time of six seconds at 190 degree(s)C with a thermode, fast production processes are possible. Therefore, up to 20,000 microchips can be bonded per hour on a flip-chip production system. The adhesive adheres well to a wide variety of flexible and rigid substrates including PET, polyimide, FR4, copper, aluminum and silver.

DELOMONOPOX AC268 was thoroughly tested in DELO's engineering labs. The tests included temperature shock tests, bending tests and storage in a climatic chamber.

With its lab equipment and knowledge as global market leader in smart label adhesives, DELO provides its customers with comprehensive support from the concept phase up to series production.

Further details can be found here.
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