“Our history in the packaging industry goes back over 100 years, and we owe our success in part to the talented Packaging Professionals here at Selig as well as throughout the Packaging Industry. We are excited to establish the Selig Sealing Products Scholarship in Packaging to promote and reward the education of packaging students who exhibit academic excellence. The scholarship is an investment in the future of Selig, the packaging industry, and a deserving, hard working student,” noted Stephen Cassidy, President and CEO of Selig Sealing Products. “Prior to establishing this scholarship, our internship program through DePaul University provided real world experience and allowed for the professional development of rising marketing talent. Today, this newly established scholarship represents our increasing commitment to an education that will provide students the opportunity to pursue a career in the packaging industry,” added Cassidy.
The 2011 Selig Sealing Scholarship in Packaging will be awarded to students with a junior or senior class standing pursuing a Bachelor of Science in Packaging at Michigan State University, with a minimum GPA of 3.2. The scholarship will be awarded by Michigan State University School of Packaging for the Fall Semester of the 2011/2012 academic year.
"We in the School of Packaging are very pleased that Selig Sealing Products has the vision to invest in our students. Selig recognizes that the future of the packaging industry is tied to the School's mission to educate future leaders in the industry and supports that vision. We congratulate them and extend our appreciation," commented Prof. Joseph Hotchkiss, Professor and Director, School of Packaging, Center for Packaging Innovation and Sustainability.
Selig Sealing Products will be exhibiting at the Interpack trade show in Dusseldorf, Germany in May, and will showcase their range of product solutions, including those of the recently acquired ISCO Corporation (Zurich, Switzerland). Members of the academic community, students and faculty alike, are encouraged to visit the booth to learn more about Selig's product offerings and technologies.
The 2011 Selig Sealing Scholarship in Packaging will be awarded to students with a junior or senior class standing pursuing a Bachelor of Science in Packaging at Michigan State University, with a minimum GPA of 3.2. The scholarship will be awarded by Michigan State University School of Packaging for the Fall Semester of the 2011/2012 academic year.
"We in the School of Packaging are very pleased that Selig Sealing Products has the vision to invest in our students. Selig recognizes that the future of the packaging industry is tied to the School's mission to educate future leaders in the industry and supports that vision. We congratulate them and extend our appreciation," commented Prof. Joseph Hotchkiss, Professor and Director, School of Packaging, Center for Packaging Innovation and Sustainability.
Selig Sealing Products will be exhibiting at the Interpack trade show in Dusseldorf, Germany in May, and will showcase their range of product solutions, including those of the recently acquired ISCO Corporation (Zurich, Switzerland). Members of the academic community, students and faculty alike, are encouraged to visit the booth to learn more about Selig's product offerings and technologies.
Companies in this article
