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MULTIVAC RX 4.0 Thermoformer

MULTIVAC used PACK EXPO Connects to feature its new RX 4.0 next-generation thermoform packaging machines.

Part of the MULTIVAC X-Line packaging technology is a process that assists in the digitalization of configuration and performance according to Industry 4.0/IoT standards. Seamless digitalization, comprehensive sensor systems, and networking with the MULTIVAC Cloud can significantly improve packaging reliability, quality, and performance.

Under the title of Smart Services, MULTIVAC offers packages that contribute to a deeper understanding of the performance of the packaging machine.  Providing valuable data which can be used to further optimize packaging procedures and make them even more efficient:

• Smart Production Dashboard—Provides real-time data of the day’s production run with historical information displayed for reference.

• Smart Machine Report—Supplies the user with automatically generated monthly reports on the machine performance.

• Smart Log Analyzer—Offers the user an opportunity to review relevant machine triggers that hamper performance to assist in improving processes.

• Smart OEE analyzer—Presents the user with historical data on the machine’s availability, performance, and quality.

Videos from MULTIVAC Inc.
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