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Digital print for blister pack lidstock
The Digiline Blister Nearline module from Atlantic Zeiser is a fully digital system for late-stage customization of lidding material to be applied to blister packs. Change from one print job to another in minutes.
May 27, 2014
New food packaging & processing solutions, all at PACK EXPO in Chicago
Experience the cutting edge of food packaging and processing innovation at PACK EXPO International this November. See machinery and equipment in action, discover new technologies, and learn sustainable solutions from experts, all in one place.
Read MoreExplore new technology from hundreds of life sciences suppliers.
At PACK EXPO International, you’ll find innovations from hundreds of exhibitors that specialize in pharmaceuticals, biologics, nutraceuticals, medical devices and more. No other show delivers as many solutions to keep your products safe and effective.
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