Discover your next big idea for life sciences at PACK EXPO Las Vegas
Experience a breakthrough in life sciences packaging—explore solutions from 2,300 suppliers spanning all industries, all in one place this September

Industrial PC

The C6027 ultra-compact Industrial PC (IPC) from Beckhoff provides high-performance, fanless computing power with scalable interface expansions and 1-second UPS.

Beckhoff C6027 Ipc

This content was written and submitted by the supplier. It has only been modified to comply with this publication’s space and style.

It offers high computing power in a compact form factor with Intel® Core™ i U series processors. Compared to the C6025 IPC already on the market, this model adds a second circuit board level for customization with a variety of optional interfaces or an integrated 1-second UPS. Further variants are in preparation.

The C6027 IPC, from automation and controls equipment manufacturer Beckhoff, opens up numerous new application areas for a modular automation device with an additional circuit board level, including a selection of interfaces or function extensions. The current options are:

• 6 x Ethernet ports (RJ45)

• an integrated 1-second UPS to secure persistent data

In the initial variant, which features a total of nine Ethernet ports, the C6027 is ideally suited as an IoT or security gateway for connecting different machine and system modules. The IPC is Microsoft Azure™ Certified and AWS qualified for use in cloud-based platforms. In addition to this edge computing functionality, the C6027 also provides machine builders and end users with a powerful and extremely compact controller, measuring 82 x 127 x 69 mm. Supported by diverse, flexible mounting options, the device can fit in almost every control cabinet and machine concept.

The IPC’s energy-efficient Intel® Core™ i U processor – which consumes significantly less energy than the other processors in the C60xx series – and the advanced passive cooling design enable full heat dissipation via a heat sink on one side. Protected by an aluminum and zinc die-cast housing, the C6027 offers a feature set that includes the following:

• up to four CPU cores

• 4 GB DDR4 RAM (expandable to 8 GB)

• 40 GB M.2 SSD with 3D flash memory

• 1 x DisplayPort video connector

• 4 x USB 3.0 ports

• on-board Ethernet controller with 3 x 100/1000Base-T ports

• operating temperature range of 0 to 50 °C


PACK EXPO Las Vegas and Healthcare Packaging EXPO (Sept. 27-29, Las Vegas Convention Center) will reunite the packaging and processing community. With over 1400 exhibitors, no other event in 2021 will bring together a more comprehensive gathering of suppliers offering new products, technologies and solutions. Attendee registration is now open.



Fill out the form below to request more information about Industrial PC
Break out of the ordinary: see what’s new in life sciences packaging
At PACK EXPO Las Vegas, you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us in September to experience a breakthrough for life sciences products.
REGISTER NOW & SAVE!
Break out of the ordinary: see what’s new in life sciences packaging
Medical Device Innovations Report
Cutting-edge packaging technologies are transforming the medical device sector in PMMI’s “Innovation in Medical Device” report, featuring advanced materials, smart solutions, and evolving regulations. Editors share insights from nearly 300 PACK EXPO booth visits—each product deemed new and truly innovative—alongside video demonstrations of the equipment and materials on display.
Learn More
Medical Device Innovations Report