SencorpWhite to Attend the 20th Annual Thermoforming Conference

SencorpWhite, a leader in the design and manufacture of thermoforming machines and sealing systems, will be attending the 20th Annual Thermoforming Conference held by the SPE Thermoforming Division at the Renaissance Convention Center in Schaumburg, IL from September 17th to 20th 2011.

SencorpWhite's systems deliver reliability and reduce cost and time to market within a variety of business segments, including consumer packaged goods, specialty foods, medical instruments and devices, and pharmaceuticals.

SencorpWhite's 2500 ULTRA Thermoformer features a larger forming area, longer oven, quick changeover system, and larger tonnage forming and trim presses to increase production throughput over 30%. In addition, the system offers the versatility to handle more diverse types of packages, plus the flexibility for shorter runs, all while increasing efficiency and profitability.

In addition, SencorpWhite's portfolio of innovative sealing systems includes:
CeraTek™ - medical pouch and tray sealers that are 100% validatable and calibratable,
and available with variable seal widths in 12” and 24” models;
CeraPak™ - blister and clamshell sealers designed for a wide variety of packages for consumer products, medical devices, specialty food, and pharmaceutical package sealing applications;

SencorpWhite's CeraTek medical pouch and tray sealers are recognized as the industry standard for consistent, validatable, and calibratable seals compatible with FDA regulations, while SencorpWhite's CeraPak line of blister and clamshell sealers and 2500 ULTRA thermoformers are ideal for thermoforming medical blisters and clamshells.

“SencorpWhite will be attending the Annual Thermoforming Conference to meet with customers, industry leaders, vendors, and colleagues,” stated Brian Urban, President and CEO of SencorpWhite. “The Conference provides us an opportunity to support our innovative thermoforming systems and further discuss how these proven machines enable customers to meet real-world requirements for reliability, high throughput, and quick tool changeover in every day, real world applications.”
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