Discover your next big idea for life sciences at PACK EXPO Las Vegas
Experience a breakthrough in life sciences packaging—explore solutions from 2,300 suppliers spanning all industries, all in one place this month.

It’s not edge vs. cloud—it’s both

An Automation World survey reveals both cloud and edge computing are central to IIoT-enabled predictive maintenance and performance monitoring applications, each at different stages of the journey.

Almost half of the respondents (43 percent) to a recent Automation World survey already have edge computing implementations underway.
Almost half of the respondents (43 percent) to a recent Automation World survey already have edge computing implementations underway.

In the world of the Industrial Internet of Things (IIoT), the noisy debate over cloud vs. edge computing masks a key fact: Manufacturers are mapping out a route that covers both, each an integral on-ramp for new predictive maintenance and performance monitoring applications at different stops on the journey.

Break out of the ordinary: see what’s new in life sciences packaging
At PACK EXPO Las Vegas, you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this month to experience a breakthrough for life sciences products.
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Break out of the ordinary: see what’s new in life sciences packaging
Medical Device Innovations Report
Cutting-edge packaging technologies are transforming the medical device sector in PMMI’s “Innovation in Medical Device” report, featuring advanced materials, smart solutions, and evolving regulations. Editors share insights from nearly 300 PACK EXPO booth visits—each product deemed new and truly innovative—alongside video demonstrations of the equipment and materials on display.
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Medical Device Innovations Report