New Tool: ProSource
Checkout our packaging and processing solutions finder, ProSource.

William L. Clippard, III honored by The Ohio State University

William L. Clippard, (Bill), chairman of the board, Clippard Instrument Laboratory, Inc., was recently honored by The Ohio State University Department of Mechanical and Aerospace Engineering for his commitment to the field of engineering.

William L. Clippard, III
William L. Clippard, III

For decades, Bill has demonstrated his passion to see engineers graduate with more practical knowledge and applicable/applied skills.

The university honored Bill by dedicating “Lab Space” within the Mechanical Engineering Building as “The Clippard Lab”, in honor of William L. Clippard, III, class of 1963. The new “Clippard Lab”, will provide students the ability to gain exposure to real world challenges while learning leading edge techniques through hands-on skill sets which has been a passion of Bill’s for years.

Since his graduation from OSU’s Mechanical engineering program, Bill has applied his creative mind along with his engineering disciplines to design and create many unique products and manufacturing processes for Clippard. Those same products and processes are used by many industries throughout the world today and serve as the catalyst in establishing Clippard as a world leader in miniature pneumatics.

Test Your Supply Chain Smarts
Take Healthcare Packaging's supply chain quiz to prove your knowledge!
Read More
Test Your Supply Chain Smarts
How to Honor a Leader
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago.
Read More
How to Honor a Leader