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A graduate of electronic engineering and management, Jenks brings with him 20 years of experience in the packaging industry and over 17 years of sales and marketing expertise.
Besides his background in electrical engineering and management, gained during his bachelor studies at the University of Birmingham, United Kingdom, Jenks has strengthened his leadership role and the ability to grow businesses in different regions and markets around the world. His experience spans across several global markets including Asia, Europe and the U.S.
“We are confident that Paul’s experience, perspective and approach will further strengthen Bosch Packaging Technology’s brand position in the market and that he will be a responsive partner for our customers, our agents and the entire Bosch organization,” says Alexander Schmitz, general manager at Bosch Packaging Technology, New Richmond.
Jenks’ capabilities in project management, marketing, communications, as well as brand and strategy development are essential for his new role at Bosch, where he is responsible for all sales and marketing functions pertaining to Bosch’s facility in New Richmond, WI, and for growing market share in territories including Canada, the U.S., Mexico and Central America.
“My goal at Bosch is to ensure that we continue to partner with our clients to deliver best-in-class technologies and solutions that help solve their everyday challenges and enhance productivity,” says Jenks. “Having been exposed to and familiar with Bosch for many years, I am excited to join the family and to play a role with this globally recognized brand.”
Jenks will be present at the International Baking Industry Exposition (IBIE) 2016 (October 8 to 11, 2016; Las Vegas, NV) and PACK EXPO International 2016 (November 6 to 9, 2016; Chicago, IL).
