An epistolary column

My Lead Off column in the July issue described how Ecovative LLC and others are turning to crop waste as a biopolymer feedstock. The column generated this intriguing exchange of e-mails.

Pw 29999 Leadoff

Pat,
I read with interest your article on the use of crop waste as a biopolymer feedstock. I work for a packaging company that is really on the “green” kick and doing everything possible to reduce waste, cost, and emissions. However, I also grew up on a farm in Nebraska—cornfields as far as the eye could see. One thing my father adopted as I entered high school around 1980 was “no-till” farming. It is a drastically different way of farming that uses much fewer chemicals, fuel, and other resources to attain similar crop yields. Now, nearly everyone in South-Central Nebraska is using the same no-till methods.
One critical aspect of no-till is “duff.” It is the same material you describe as feedstock for the protective packaging Ecovative makes. It is also absolutely critical to the long-term viability of the soil. Remove the duff, and soon you’ve removed all the nitrogen and organic materials necessary for sustainable crop yields. The duff also provides water-absorbing capabilities and reduces runoff.
While you describe this as “… one of the most fascinating packaging stories in the decade to come,” I see it as a most alarming development. Unscrupulous farmers with short-term gains in mind will ruin their soil for years to come. Look for stories about excessive erosion and waterway siltation, plunging yields, and increased demands for things like anhydrous ammonia (inorganic fertilizers). While the story sounds like a magic bullet, unfortunately, the gun is pointed at the farmers’ heads.
Respectfully, Eric Davidson, Project Manager, Tetra Pak

 

Eric,
Yours is an interesting perspective, to say the least. I wonder if the role played by duff in growing corn is similar where cotton or oats or other crops are concerned? Would you mind if I forward your inquiry to Sam Harrington at Ecovative?
Pat

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