The PACKage Printing Pavilion, the industry’s main stage for package printing innovations, will debut at PACK EXPO International 2018 (October 14–17, 2018, McCormick Place, Chicago), announces PACK EXPO show producer, PMMI, The Association for Packaging and Processing Technologies.
SKU proliferation, micro marketing efforts, sustainability and traceability concerns are driving companies toward digital packaging applications. Meanwhile, more and more suppliers at PACK EXPO International are exhibiting digital products, with an emphasis on smart packaging applications. The new PACKage Printing Pavilion brings together these digitally charged end-users and OEMs. The 60,000 square-foot pavilion area specifically targeting package printing, located in the South Building at McCormick Place, shines a spotlight on digital printing and converting technologies for short-run, on-demand, cost-effective, variable data and personalized packaging.
